LS Grid Core LED Connector System and Manufacturing Method

ABSTRACT

A new method, system and apparatus for mounting mechanically, thermally and electrically light emitting diode (LED), crystals, arrays or packages. The above provides an LED assembly having reduced number of components and costs, superior heat dissipation, mechanical properties and a compact structure. The use of a grid or mesh allows for more efficient and inexpensive removal of heat from one or more LEDs within an LED fixture.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of pending U.S. patent application Ser.No. 17/790,094 titled “LS Grid Core LED Connector System andManufacturing Method”, filed on Oct. 23, 2017 the disclosure of which isbeing incorporated herein by reference in its entirety.

Patents Cited

The following documents and references are incorporated by reference intheir entirety; (Ogawa et al (U.S. Pat. No. 7,714,346), Kang et al (U.S.Pat. No. 7,642,563), Mok et al (U.S. Pat. No. 7,262,438), Zykin (U.S.Pat. No. 9,240,538) and Zykin (U.S. patent application Ser. No.14/076,682, Ser. No. 14/076,711, Ser. No. 14/989,184 and Ser. No.14/997,606).

FIELD OF THE INVENTION

The present invention relates to Light Emitting Diodes (LEDs) mountingwithin electrical and mechanical structures, fixtures, troffers, framesand in particular to devices, systems and methods for the efficient andinexpensive removal of heat from the LEDs in LED light fixtures.

DESCRIPTION OF THE RELATED ART

LEDs promise to revolutionize illumination, through theirultra-efficient conversion of energy/electricity into visible light.Within a decade, we have gone from illumination provided by a 60 Wincandescent light bulb being replaced by a 13 W Compact FluorescentLight bulb (CFL) to a 3 W LED light bulb. In effect, reducing by over90% the consumption required for similar illumination. The above is notonly important because it saves energy, but also because now we canilluminate the world without the need to electrify the world.

An LED is an element in which electrons and holes are combined in asemiconductor junction structure by application of current therebyemitting certain types of light. LEDs are typically formed to have apackage structure, in which an LED chip is mounted on a mechanicalcarrier, frequently referred to as an “LED package.” Such an LED packageis generally mounted on a printed circuit board (PCB) and receivescurrent applied from electrodes formed on the PCB to thereby emit light.

In general illumination applications, engineers have discovered theimportance of generating light in a 360 DEGREE (deg.) envelope, notunlike the way in which an incandescent filament illuminates. Toaccomplish such goals, a new type of package termed an LED sticks or LEDstraw has been created. In it, individual LEDs are serially placed alonga thin sleeve or slice of material, typically made of a sapphire,ceramic and other material with an electrical conductive capabilitymaterial. The stick is powered from each end, creating a stick of light.

In an LED package, heat generated from the LED chip has a directinfluence on the light emitting performance and life span of the LEDpackage. When heat generated from the LED chip is not effectivelyremoved, dislocation and mismatch occur in a crystal structure of theLED chip. In effect, brightness is related to power applied, so a largeamount of heat is generated in an LED chip due to the high currents,heat that must be typically transferred to a heat sink, typically, aseparate device for effectively dissipating the generated heat isrequired.

LEDs are typically mounted on printed circuit boards (PCBs), which areused to mechanically support and electrically connect the LEDs toelectronic drivers (power supplies, amplifiers, ballast, etc.) usingconductive pathways, tracks or signal traces etched from copper/aluminumand/or electrically transmissive sheets laminated onto a non-conductivesubstrate. This substrate is typically a dielectric or insulator. Someof these dielectrics include Teflon, FR-4, FR-1, CEM-1 or CEM-3.

The above has a significant limitation, the thermal transfer from theLED package to the heat sink, is going through a plastic, not theoptimal way in which to efficiently transfer heat. What is needed, is away in which to mechanically support and electrically connect the LEDpackage to a heat sink with the highest efficiency possible.

SUMMARY OF THE INVENTION

This section is for the purpose of summarizing some aspects of thepresent invention and to briefly introduce some preferred embodiments.Simplifications or omissions may be made to avoid obscuring the purposeof the section. Such simplifications or omissions are not intended tolimit the scope of the present invention.

In one aspect the invention is about an LED light source comprising anLED chain formed from one or more LED packages, each said LED packagehaving one or more anode leads and one or more cathode leads, so that atleast one said anode lead is mechanically and electrically attached toone or more anode wire mesh(es), and at least one said cathode lead ismechanically and electrically attached to one or more cathode wiremesh(es), wherein one or more of said anode wire mesh(es) and one ormore of said cathode wire mesh(es) are electrically connectable to theappropriate polarity of a power source. In another aspect, said anodeand cathode wire mesh(es) are comprised of one or more of the followingmesh types: wire strand, welded wire mesh, woven wire mesh, expandedwire mesh, expanded metal sheets and/or perforated metal sheets. Inanother aspect, each said anode and each said cathode wire meshes areinserted into a container shaped as a tube. In yet another aspect, eachsaid anode and cathode wire meshes are bent in 3-D space. In anotheraspect, each said anode and cathode wire mesh(es) are secured withinsaid tube to a slot. In yet another aspect, said ends of said tube arecapped by one or more caps, with at least one said cap having a lead tomake electrical connection with one or more said anode wire mesh, and alead to make electrical connection with one or more said cathode wiremesh. In another aspect, said ends of said tube are capped by one ormore caps, with at least one said cap having a lead to make electricalconnection with one or more said anode wire mesh, and a lead to makeelectrical connection with one or more said cathode wire mesh.

In one aspect, the invention is about an LED light source manufacturingmethod comprising mechanically and electrically attaching at least oneanode lead of an LED package to an anode wire mesh, mechanically andelectrically attaching at least one cathode lead of said LED package toa cathode wire mesh.

In one aspect, the invention is about an LED light source comprising twoor more LED chains, each LED chain formed from one or more LED packages,so that at least one said LED package in each said LED chain has one ormore anode leads connected to a common anode or cathode wire mesh andone or more corresponding cathode or anode lead connected to a separatewire mesh, wherein one or more of said anode wire mesh(es) and one ormore of said cathode wire mesh(es) are electrically connectable to theappropriate polarity of a power source. In another aspect, each saidanode and each said cathode wire meshes are inserted into a containershaped as a tube. In yet another aspect, each said anode and cathodewire meshes are bent in 3-D space. In another aspect, each said anodeand cathode wire mesh(es) are secured within said tube to a slot. In yetanother aspect, said ends of said tube are capped by one or more caps,with at least one said cap having a lead to make electrical connectionwith one or more said anode wire mesh, and a lead to make electricalconnection with one or more said cathode wire mesh. In another aspect,said ends of said tube are capped by one or more caps, with at least onesaid cap having a lead to make electrical connection with one or moresaid anode wire mesh, and a lead to make electrical connection with oneor more said cathode wire mesh.

Other features and advantages of the present invention will becomeapparent upon examining the following detailed description of anembodiment thereof, taken in conjunction with the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-5 show some prior art illustrations for LED technology.

FIG. 6 shows a grid/mesh mounted LED chip assembly, according to anexemplary embodiment of the invention.

FIGS. 7-8 show various versions of LED chips, according to exemplaryembodiments of the invention.

FIGS. 9-10 show various versions of wire mounted LED chips, according toexemplary embodiments of the invention.

FIGS. 11-13 show various versions of LED chips mounted on wire and wiremeshes, according to exemplary embodiments of the invention.

FIGS. 14-15 and 45-47 show tube mounted, mesh versions of LED chipassembly, according to exemplary embodiments of the invention.

FIGS. 16, 20-21, 23 and 26-37 show grid/mesh mounted LED chipassemblies, according to exemplary embodiments of the invention.

FIGS. 17-19 show tube mounted, mesh versions of LED chip assembly,according to exemplary embodiments of the invention.

FIGS. 22, 24 and 25 show an X-shaped, tube mounted, mesh versions of LEDchip assembly, according to exemplary embodiments of the invention.

FIG. 38 shows a mounting process grid/mesh LED chip assembly diagram,according to an exemplary embodiment of the invention.

FIGS. 39-44 show the tube mounted electrical connection interfacediagram, according to exemplary embodiments of the invention.

The above-described and other features will be appreciated andunderstood by those skilled in the art from the following detaileddescription, drawings, and appended claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

This section is for the purpose of summarizing some aspects of thepresent invention and to briefly introduce some preferred embodiments.Simplifications or omissions may be made to avoid obscuring the purposeof the section. Such simplifications or omissions are not intended tolimit the scope of the present invention.

To provide an overall understanding of the invention, certainillustrative embodiments and examples will now be described. However, itwill be understood by one of ordinary skill in the art that the same orequivalent functions and sequences may be accomplished by differentembodiments that are also intended to be encompassed within the spiritand scope of the disclosure. The compositions, apparatuses, systemsand/or methods described herein may be adapted and modified as isappropriate for the application being addressed and that those describedherein may be employed in other suitable applications, and that suchother additions and modifications will not depart from the scope hereof.

Simplifications or omissions may be made to avoid obscuring the purposeof the section. Such simplifications or omissions are not intended tolimit the scope of the present invention. All references, including anypatents or patent applications cited in this specification are herebyincorporated by reference. No admission is made that any referenceconstitutes prior art. The discussion of the references states whattheir authors assert, and the applicants reserve the right to challengethe accuracy and pertinence of the cited documents. It will be clearlyunderstood that, although a number of prior art publications arereferred to herein, this reference does not constitute an admission thatany of these documents form part of the common general knowledge in theart.

As used in the specification and claims, the singular forms “a”, “an”and “the” include plural references unless the context clearly dictatesotherwise. For example, the term “a transaction” may include a pluralityof transaction unless the context clearly dictates otherwise. As used inthe specification and claims, singular names or types referenced includevariations within the family of said name unless the context clearlydictates otherwise.

Certain terminology is used in the following description for convenienceonly and is not limiting. The words “lower,” “upper,” “bottom,” “top,”“front,” “back,” “left,” “right” and “sides” designate directions in thedrawings to which reference is made, but are not limiting with respectto the orientation in which the modules or any assembly of them may beused.

It is acknowledged that the term ‘comprise’ may, under varyingjurisdictions, be attributed with either an exclusive or an inclusivemeaning. For the purpose of this specification, and unless otherwisenoted, the term ‘comprise’ shall have an inclusive meaning—i.e. that itwill be taken to mean an inclusion of not only the listed components itdirectly references, but also other non-specified components orelements. This rationale will also be used when the term ‘comprised’ or‘comprising’ is used in relation to one or more steps in a method orprocess.

Referring to FIGS. 1-5, we see the traditional lead frames or lead LEDframes 100, which are used today to distribute and ship LED packages 102(said packages comprised of both lensed LED packages and non-lensedones) throughout the industry. These frames consist of a lattice 106having one or more orthogonal horizontal 108 and vertical 110 membersthat hold the LEDs in place, and are used for shipping from LED mfr. tothe LED light fixture assembly mfr.

At the light fixture manufacturing site, the LEDs 102 are cut off fromthe frame strips lattice members 108, 110 and become loose, independent,individual light-emitting diodes LEDs 102. During manufacturing, theLEDs 102 are then soldered onto a printed-circuit board (PCB) 402.

The above has a large number of disadvantages, one of the primary onesbeing the fact that the already aligned and prepositioned LEDs 102 areloosened, before being re-attached to the PCB 402. This step requiresmachinery to align and position the LEDs 102. Referring to FIG. 5, wesee that a quick improvement on the PCB 402 mounting method, would be500 to mount the LEDs 102 as the link between two frames 502, 504 sothat the one or more LED chips 502 are mounted on the frames 502, 504 sothat the frame portions 502, 504 act as heat dissipation ‘fins’ oremitters.

One embodiment of the proposed solution described here improves on theabove not only completely eliminating the PCB 402 used to position theLEDs 102, by making the lead frame a grid, mesh or wire frame comprisedof one or more wires that connects to the LEDs 102 electrically,mechanically and thermally at one or more points. Note that the gridsmay be used to attach not only LED 102 components, but also to add theother electronic components necessary to operate the electronics,including resistors, capacitors, drivers, etc., all of them mountedacross the voltage difference and/or separately as required.

We disclose here a number of embodiments based on mounting 600 the LEDs102 on two or more metal frames 602 comprised of one or more wires so asto form a grid or mesh of wires, as opposed to the traditional metalframe 100 and or the frames 500.

When we describe a wire mesh or wire grid, we refer to a number ofpossible embodiments. including two or more wires, welded wire mesh,woven wire mesh, expanded wire mesh, expanded metal sheets, andperforated metal sheets. Welded wire mesh is a metal wire screen that ismade from various alloys including steel, stainless steel, brass andcopper. It is available in various sizes and shapes. Grids of parallellongitudinal wires are welded to cross wires at the required spacing,using electric fusion. The machines that are used to produce the meshhave precise dimensional control. In addition, it includes interlockingwire, knit, snare, braid weave, lattice, filigree, penwork, structuretracery Matrix, and waffle assemblies

Woven wire mesh is typically also available in steel, stainless steel,brass and copper, woven wire mesh is made as a cloth with wire threadswoven at angles. Wires which run lengthwise are known as warp wires,whilst those running perpendicular are weft wires. There are two commonstyles of weave: plain weave and twill weave. It can be made fromvarious electrically conducive alloys including stainless steel, brass,aluminum, tungsten titanium and copper. Wire cloth can be woven tocreate a variety of opening sizes and wire diameters. The woven wiremesh may also be stretched to become expanded wire mesh.

Expanded sheet metal is made by first creating multiple slits in thesheet, and then stretching the sheet. The stretching creates a uniquediamond pattern opening with one of the strands protruding at a slightangle. These raised strands can be flattened later in the process ifdesired. This process creates no waste (thus keeping down productioncosts) and it can add structural strength and thermal transferefficiency to the product.

Perforated metal sheet is a product that is made from sheet steel thathas been fed through a machine that punches out round holes (or otherdesigns). These holes can be straight rows or staggered to increase theamount of the openings. Typically the perimeter of the sheet has aboundary where holes are not punched; this adds stability to the sheet.

The LED chip packages 102 may be comprised of a number of packages basedon the configuration of the LED holder leads as extended in variousforms 702, 704, 706 and 708. In effect, instead the flat surface 502,504 is dissipating heat in primarily an up/down direction (that is,along the fascia of the maximum metal surface), with a minimal amount ofheat emitted along its edges. In contrast, one proposed embodiment 900utilizes two primary wire, side bars or guides 902, 904 whichmechanically support the one or more LED chips 102. In effect, the sidebars provide power to the LED chips via the voltage differential betweenthe anode (902) and the cathode (904) sides of the LED 102 each one, aswell as provide cooling of the heat generated within the LED chip.

In another embodiment 1600, the LED chips 102 are powered by a voltagelaid across the continuous mesh grids 1502/1504. In an alternateembodiment 600, sequences of two or more LEDs 102 are connected to avoltage source, and the meshes of similar voltages 1502 are powered byparallel connections, so that the LEDs 102 receive the correct voltages.

Looking at FIG. 20, we see that in one embodiment a chain of two or morecascading LEDs 102, powered by an initial mesh 1502, and the drop fromthe first LED row 102, generates a voltage 1502′ which powers an LEDchip row 102′, powering a follow on mesh 1502″ of LEDs 102″, andsuccessively, until the final mesh 1504 is found. By powering 1502 and1504, you have an electric circuit that will survive the failure of oneparticular LED. In an alternate embodiment, the anode 1502 and cathode1504 could be alternated, so that the odd/even rows of LEDs 102 would becompletely powered. In FIG. 21, the meshes 1502 and 2102 have identicalvoltages.

The heat is transferred to the side bar, which being primarily tubeshaped, proceeds to emit the heat energy Omni directionally along thelength of the side bar. In addition to the heat dissipation, notice thecurvature along the length of the side bar. This provides forsignificant stress relief along the length of the sidebars as they heatand cool during the power cycle of the LED chips.

As seen in FIG. 10, the connection 1000 to the LED chip may beaccomplished via a loop 1006, which then also contributes to theexpansion of the mechanical structure of the side bars 1002/1004 inconnection to the LED chips. The loops 1006 may additionally be used tomount the light string 1000. Note the side bars may also be 1100 wavybar arrangements 1202 onto which the LEDs chips 102 are mounted, in thiscase using two or more wavy bars 1202 which house LEDs 102 eachstraddling a bar 1200, so that a sequence of LEDs 102 form the lightsource stream 1200.

One or more of these LED 102 chains 1406 may be formed by connecting theLEDs 102 to a mesh on each side of the LEDs 102 (side leads 1502 and1504 each with a separate voltage), so that when inserted 1400 within atube 1404 along two or more parallel slots 1402 within suitably modifiedtubes, including but not limited to the more common T-5, T-8 or othersuitable enclosure tube 1404 (as well as lamps, bulbs, and otherenclosures) the LEDs 102 are suspended in space while the voltage may beprovided separately.

Said enclosure tube may have the aforementioned slots 1402 or be smooth1500 and have the leads 1502 and 1504 from the LED strips 102 bent sothey extend outside of the strips without significantly occluding thelight emitted from the LEDs. Thus in addition to serving as a thermalradiator, they mechanically support the LED strips 102 within theenclosure tube 1404. The above may include flat bottom formed tubes1700, as well as triangular shaped (3 sided), with the edges where thetriangle sides meet being sharp or rounded (to avoid optical effects).

Said enclosure tube(s) may have the aforementioned slots 1402. Note thatin all enclosure cases, i.e. bulbs, lamps or the T-5/T-8 tubes 1404,there could be introduced into the enclosure space a gas mix. Besides agas mix, the complete lighting package may be immersed in a temperaturereducing or cooling fluid, which may be a dielectric to preserveelectrical integrity while providing cooling. Such fluids may includeinert gases.

The mounting/connecting of the LEDs 102 to the wire's anode/cathodesneed not be limited to a single side bar 1002, 1004 or wavy bars 1102,1202, but in fact may be accomplished by a grid or web of wires 1600,separated into an electrical channel one 1502 and another 1504 (itselfformed from wires and/or stamped, laser cut from a sheet), as long asthe above described principle of Omni directionally transmitted heatdissipation is obeyed. In effect, we see 1600/2300 an embodiment where aweb is split between two zones 1502, 1504 (as above, so that a voltagedifferential across LEDs can be established between web/wire grid 1502and 1504), which allows the LED chips 102 straddling the center to belit when a voltage is applied across the two meshes 1502/1504. As beforethe ends of the grid 1502/1504 may then be used to fit and hold the LEDstring within a channel 1402 in a tube 1404, allowing the illumination.

It is notable that the openings in the mesh/grids 1502/1504 not onlyallow for more efficient cooling (via the Omni-directional heatdissipation aforementioned), but also allow for light to go through(FIGS. 17, 18, 19, 22) improving the Omni-directional lighting of thesource. As shown in FIGS. 22, 24-25, the LEDs 102 may jump acrossX-shaped meshes 1502/1504 so that many more LEDs are packed within avolume.

Looking in detail at FIGS. 22, 24, 25 we see a more dense(volumetrically speaking) collection of LEDs 102 along the center of theassembly 2202 formed by creating an X-shaped, T-shaped or cross of threeor more meshes 1502, 1504 with the LEDs 102 at its center. Two centralLED chains are formed by connecting the anodes of each LED forming eachchain to a single anode mesh, and the cathodes of each LED chain isconnected a separate cathode wire mesh (the above may be reversed byconnecting the cathodes to a single mesh, then the anodes to twoseparate meshes. In this form, double the density of LEDs (whose lightcomes out through the openings in the meshes) is accomplished.

In all cases, the voltage drop between the anode and the cathode sidesof the LEDs 102 provide the necessary voltage to control de LEDs, withthe additional advantage of the ‘double’ row of LEDs within the center.Such an arrangement within a tube may then be simply supported by theirplacement within the tube, or within slots in the tube. Finally, as withall the other implementations, the cooling effect may be augmented bythe addition of a gas or fluid contained within said tube.

Note the LEDs chips 102 may be soldered, chemically attached usingconductive glues and/or epoxies, mechanically clamped, interwoven, spotwelded, reflowed or otherwise suitably attached to the side bars, wavybar or grid 1600, as long as the connection is both electrical andthermal (3200, 3500, 3600).

FIG. 26 illustrates an embodiment 2600 where the mesh strands orsegments 1502, 1504 are secured to each other via epoxy or flexiblesilicone structures 2302, which may be infused, covered, embodied withconductive elements to ensure the structure remains flexible, yetelectrically conducive, ensuring both segments 1502 are the samevoltage.

Note the mesh 2700 may vary its density (FIGS. 27-31), so that ahigh-powered LED mounting on the mesh uses a significant area of themesh (both with multiple contacts and/or larger area solder spots), sothat more heat is transferred to the mesh segments 1502/1504. Inaddition, the mesh may be bent in 3-D (i.e. space, three dimensions)2900 allowing for the significant illumination while dissipating theheat generated.

FIG. 38 illustrates a method of mfr. 3800 which comprises a mesh 1600and LED chips 102 coming together directly from the LED package (withoutpick/place), by simply bringing the LED string package in contact withthe mesh, then welding 3802 the LEDs to the mesh through such methods aslaser spot welding and or simple spot welding. Such an attachment wouldbe superior to the traditional soldering where a material is usuallyreflowed), by avoiding exposing the LED to the higher temperature of thereflow. The mesh would then be used as the ‘roll’ 3804 in the resultingLED LS core.

When used in a T-5, T-8 or similar fluorescent bulb (FIGS. 39-44)replacement fixture, the ends of the mesh strip 1502/1504 may makedirect contact with the tube leads 4102/4104, so that the cap 4110either passes the voltage/current directly (i.e. with no PCB involved)and/or converts it with electronics inside the cap 4110, so that themechanical pressure on the mesh 1502/1504 by the leads 4106/4108 bothtransmits the voltage/current and acts as a heat sink to form a constantand efficient metal-to-metal heat transfer medium to the housing. On oneembodiment, the housing is completely translucent, but in another, thebottom of the tube housing 4002 is metal, with the top 4004 beingtranslucent, so that the bottom 4002 acts here as the heat sink.

CONCLUSION

In concluding the detailed description, it should be noted that it wouldbe obvious to those skilled in the art that many variations andmodifications can be made to the preferred embodiment withoutsubstantially departing from the principles of the present invention.Also, such variations and modifications are intended to be includedherein within the scope of the present invention as set forth in theappended claims. Further, in the claims hereafter, the structures,materials, acts and equivalents of all means or step-plus functionelements are intended to include any structure, materials or acts forperforming their cited functions.

It should be emphasized that the above-described embodiments of thepresent invention, particularly any “preferred embodiments” are merelypossible examples of the implementations, merely set forth for a clearunderstanding of the principles of the invention. Any variations andmodifications may be made to the above-described embodiments of theinvention without departing substantially from the spirit of theprinciples of the invention. All such modifications and variations areintended to be included herein within the scope of the disclosure andpresent invention and protected by the following claims.

The present invention has been described in sufficient detail with acertain degree of particularity. The utilities thereof are appreciatedby those skilled in the art. It is understood to those skilled in theart that the present disclosure of embodiments has been made by way ofexamples only and that numerous changes in the arrangement andcombination of parts may be resorted without departing from the spiritand scope of the invention as claimed. Accordingly, the scope of thepresent invention is defined by the appended claims rather than theforegoing description of embodiments.

1. An LED light source manufacturing method comprising; Mechanically andelectrically attaching at least one anode lead of an LED package to ananode wire mesh, mechanically and electrically attaching at least onecathode lead of said LED package to a cathode wire mesh.
 2. An LED lightsource comprising; two or more LED chains, each LED chain formed fromone or more LED packages, so that at least one said LED package in eachsaid LED chain has one or more anode leads connected to a common anodeor cathode wire mesh and one or more corresponding cathode or anode leadconnected to a separate wire mesh; wherein one or more of said anodewire mesh(es) and one or more of said cathode wire mesh(es) areelectrically connectable to the appropriate polarity of a power source.3. the LED light source of claim 2, wherein; said anode and cathode wiremesh(es) are comprised of one or more of the following mesh types: wirestrand, welded wire mesh, woven wire mesh and/or expanded wire mesh. 4.the LED light source of claim 3, wherein; each said anode and each saidcathode wire meshes are inserted into a container shaped as a tube. 5.the LED light source of claim 4 wherein; each said anode and cathodewire meshes are bent in 3-D space.
 6. the LED light source of claim 5wherein; each said anode and cathode wire mesh(es) are secured withinsaid tube to a slot.
 7. the LED light source of claim 6 wherein; saidends of said tube are capped by one or more caps, with at least one saidcap having a lead to make electrical connection with one or more saidanode wire mesh, and a lead to make electrical connection with one ormore said cathode wire mesh.
 8. the LED light source of claim 5 wherein;said ends of said tube are capped by one or more caps, with at least onesaid cap having a lead to make electrical connection with one or moresaid anode wire mesh, and a lead to make electrical connection with oneor more said cathode wire mesh.
 9. the LED light source of claim 2,wherein; said anode and cathode wire mesh(es) are comprised of one ormore of the following mesh types: expanded metal sheets and/orperforated metal sheets.